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Home » Ultrasil Product Information |
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Optional Double bonded active layer SOI Wafers: |
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We can supply double bonded wafers in most thickness and oxide layer combinations. Some items in our on-line inventory. |
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Use as an alternate to thick film Epitaxial with High resistivity or for creating unique structures by bonding different orientations with different doping levels. |
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Standard and Double Side Polished Wafers |
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Double side polished via simultaneous double side polishing Check for availability of specifications. |
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On-Line Inventory for Quick Delivery |
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We have the largest inventory of SOI wafers on the Internet. Check specification availability by going to the inventory looks up. |
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Our Facility and Equipment |
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We are currently occupying 9000 square feet at our current location which includes 600 square feet of class 10 clean room. The wafer cleaning, bonding, sorting, packaging, and labeling are all completed in clean room. |
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A Partial List of Our Equipment Includes: |
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Rigaku xray machines for verifying slice and flat orientation on both ingot and slices |
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150mm Slicing Capability |
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150mm edge grinding capability |
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Double side lapper up to 200mm |
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Caustic etching station up to 200mm |
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Speedfam Double Side and Single side polishers up to 200mm |
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RCA cleaning Deck |
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Okamoto precision surface grinding up to 200mm and 1um tolerance |
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Filmetrics F50 thin film-measuring equipment |
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ADE 6034 Bow/Warp measurement capability |
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Ultrasil designed bonding machine with built-in infrared camera |
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State of the art DI water plant with minimum 18-megohm water. |
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