Ultrasil LLC, with the new and improved technology of the SOI wafers product, we added some new tooling and capabilities to our production. We offer double bonded SOI wafers (DSOI), Triple device SOI wafers (TDSOI), Wafer to Wafer bonding, Grind and Polishing Services, SOI wafers with implants and/or coatings, Laser Cutting and Edge Grinding of Silicon Wafers, Laser Marking, Oxidations, Annealing and other services related to Silicon Wafers and Silicon on Insulator (SOI) wafers

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