Introducing Ultrasil LLC, where innovation meets excellence in silicon wafer technology. With our latest advancements in SOI wafer production, we've revolutionized our capabilities to offer cutting-edge solutions for your semiconductor needs.

Our product lineup now includes:

          •  Double bonded SOI wafers (DSOI)
          •  Triple device SOI wafers (TDSOI)
          •  Wafer-to-wafer bonding
          •  Precision grind and polishing services
          •  SOI wafers with customizable implants and coatings
          •  Laser cutting and edge grinding of silicon wafers
          •  Laser marking for precise identification
          •  Oxidation and annealing services for optimal performance


Contact us today via email or phone to request a quote and experience the difference with Ultrasil LLC.

Phone:  +1 (510) 266-3700